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2inch Molecular Beam Epitaxy System

Molecular Beam Epitaxy (MBE) systems, characterized by ultra-high vacuum conditions, ultra-high precision, and ultra-uniform thin film deposition, serve as critical process equipment for compound semiconductor material and device fabrication.
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2inch Molecular Beam Epitaxy System 

Molecular Beam Epitaxy (MBE) systems, characterized by ultra-high vacuum conditions, ultra-high precision, and ultra-uniform thin film deposition, serve as critical process equipment for compound semiconductor material and device fabrication. These systems are extensively employed in the preparation of epitaxial thin films for solid-state microwave radio frequency devices, semiconductor lasers, detectors, and related applications.

The ACG-MBE-400 is designed for the preparation of high-performance oxide materials, topological insulators, and more. Its modular design allows interconnection with load-lock equipment to enable the deposition of diverse materials.


Technical Parameter

Wafer size2inch
Vacuum MeasurementIon gauge + Cathode gauge + Pirani gauge
Ultimate VacuumBetter than 1×10^−10 mbar
Vacuum Pump SystemMechanical pump + Molecular pump + Adsorption pump + Cold trap (liquid nitrogen, optional)
Temperature ControlRT–800°C (RT–1200°C optional)
Evaporation Source6-10, different types of evaporation sources and electron beam sources
Thickness MeasurementRetractable thickness monitor
In-situ MonitoringOptional RHEED
Load Chamber6×2-inch wafer compatible
Control SystemPC + PLC, fully automatic operation with safety interlock
Dimension3m (L) × 2m (W) × 2m (H)
Optional FeaturesLow-throughput pump, automatic transfer, reactive sputtering, thickness monitor, process recipes, high-pressure RHEED, etc.